Details

Detailed Product Description Specifications: 1. Total power: 3000 W 2. Top heater: 800 W 3. Bottom heater: 2000 W 4. Power supply: single-phase 220 VAC 50/60Hz 3KVA 5. Machine Dimension: 450 × 380 × 580mm 6. Temperature control: high-precision K Sensor 7. Positioning: V-groove for PCB positioning, Max PCB size: 300 × 320mm 8. Weight: About 25 kg Features: 1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely. 2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time. 3. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it. 4. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely. 5. Top & bottom heating can be controlled independently by the temperature graphs.A cross-flow fan cools rapidly to protect the PCB from deformation when welding. 6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.