YESTechs YTV M1m, with advanced Thin Camera technology, offers high-speed microelectronic device inspection with exceptional defect coverage. With 3 micron pixel resolution and telecentric optics, the M1m inspects bond wires, die placement, e...
YESTech's advanced Thin Camera technology offers off-line benchtop PCB inspection with exceptional defect coverage. This benchtop system inspects solder joints and verifies correct part assembly enabling users to improve quality and increase thr...
It can be placed at several quality controlling points in SMT Line to check 2D paste printing quality,inspect component defects before feflow soldering,inspect PCBA quality after reflip soldering and DIP wave soldering.
2.Simple software int...
Typical applications include:
Measuring and production equipment in the semiconductor industry
PCB assembly machines
Ultra-precision machines ...
Ture 3D profilometric volume measurement based on the world’s best patented 100% 3D shadow-free measurement technology
Real-time defect detection
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